A heat sink for the electronic device is disclosed. The heat sink comprises a hub, a plurality of first supporting elements and a frame. A fan is axially connected to the hub. The first supporting elements are positioned along the periphery of the hub and protrude outwards extending from the protruding ends to connect to the frame. The frame forms an outlet and connects to a heating element. Thus, the outlet and the fan have the side opposite to the fan set facing the heating element so that the distance between the fan and the heating element may be reduced. Thus, the loss of the air flow pressure may be minimized and the heat dissipation effect may be effectively promoted.