The present invention provides a cationically photocurable epoxy resin composition, which contains (a) an epoxy resin component comprising an alicyclic epoxy resin and an aromatic-ring containing epoxy resin, (b) a cationic photoinitiator component, and (c) a filler selected from oxides, hydroxides and carbonates containing a Group II element. This composition exhibits improved adhesive strength to a glass such as an alkali glass, particularly a sodium-containing glass, or a metal.