A surface acoustic wave element includes a piezoelectric substrate, an IDT composed of a pair of first and second comb-like electrodes, formed around a center of the piezoelectric substrate, and formed on a surface of the surface acoustic wave element, and a pair of first and second terminals electrically connected to the IDT, formed at central and peripheral areas of the piezoelectric substrate, respectively, in which a package is bonded with an adhesive to a surface of the surface acoustic wave element, opposite to the surface formed with the IDT.