An electronic component adapted to be mounted on a substrate with landing pads having a landing pad layout has a power semiconductor device and outer contact surfaces with a component pad layout. The outer contact surfaces have an arrangement so that, in a first orientation, the component pad layout matches the landing pad layout and in a rotational reorientation of the entire electronic component about the component axis by an angle other than 360.degree., the outer contact surfaces are translated to each other so that the component pad layout matches the landing pad layout.