The invention relates to a method for modifying a metallic surface, which method comprises chemical vapour deposition on a substrate in a chamber adapted for CVD and involves at least the step of interrupting the chemical vapour deposition by cutting off the flow of reactant gas, and where the substrate and the metallic surface form a part of a completed member and that this member during or after the interruption is subjected to a polishing of the metallic surface after depositing at least a part of the depositing metallic compound.