A heat dissipation device is used for dissipating heat from a CPU and electronic components. The heat dissipation device includes a heat absorbing portion for absorbing heat from the CPU, and a heat sink located on the heat absorbing portion. The heat sink includes a plurality of curved fins defining a plurality of curved passages therebetween. An airflow source is located adjacent to the heat sink for providing forced airflow to the heat sink. A direction of the airflow from the airflow source is changed when it passes through the passages. A direction of the airflow out of the passages is perpendicular to a direction of the airflow into the passages. The airflow out of the heat sink further flows to the electronic components located adjacent to the CPU.