A heat dissipation apparatus (100) includes a fan bracket (20), a fan (10) and a heat sink (40). The fan bracket includes a housing (22), a support portion (242) extending from the housing, and a plurality of arm portions (244) extending from the housing in a direction opposite to the support portion. Each of the arm portions includes an engaging portion (244a) extending outwardly therefrom, engaging with a fastener (30) to mount the heat dissipation apparatus to a printed circuit board (50). At least two arm portions each include a hook (244c) extending inwardly therefrom. The fan is attached to the support portion of the fan bracket. The heat sink is held between the arm portions of the fan bracket with a bottom surface of the heat sink engaging with the hooks.