In one embodiment, a stack is assembled comprising a first integrated circuit package, and a substrate connector which connects the integrated circuit package to a circuit board. In one embodiment, the substrate connector includes an interposer substrate and a patch substrate bonded to the interposer substrate. Each substrate includes columnar conductors extending through the substrate to connect to another layer. Other embodiments are described and claimed.

 
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> Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device

> Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus

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