An electronic component and method for its assembly is disclosed. In one
embodiment, the electronic component comprises at least two semiconductor
components and a circuit carrier comprising a die pad and a rewiring
structure. At least one semiconductor component is a vertical
semiconductor power switch having an upper surface comprising at least
one electrode and a lower surface comprising at least one electrode. The
lower side of the at least two semiconductor components is attached to
the die pad by a diffusion solder bond.