A three dimensional electronic module is disclosed. Conventional TSOP packages are modified to expose internal lead frame interconnects, thinned and stacked on a reroute substrate. The reroute substrate comprises conductive circuitry for the input and output of electrical signals from one or more TSOPs in the stack to a ball grid array pattern. The exposed internal lead frames are interconnected and routed on one or more side buses on the module to the reroute substrate for connection to external electronic circuitry. Alternatively, internal wire bonds or ball bonds may be exposed in the TSOP packages and routed to the side bus for interconnection to create a BGA scale module. One or more neolayers may also be bonded to a reroute substrate to create a BGA scale module.