An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described wherein the bond pad on a surface of the semiconductor device comprises a layer of copper and at least one layer of metal and/or at least a barrier layer of material between the copper layer and one layer of metal on the copper layer to form a bond pad.

 
Web www.patentalert.com

< Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

> Optical device and method for fabricating the same

> BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same
~ 00508