A patterning method comprising (a) providing a substrate having a sacrificial layer made of a first material, partially or totally formed on the substrate, (b) forming pattern grooves, which are free from the first material and have a line width of a first resolution or lower, on the sacrificial layer by using a first means, by which the sacrificial layer is directly processed to form a line, (c) filling the pattern grooves with a second material to a second resolution by using a second means, to form a pattern of the second material on the substrate. This method provides a high-resolution pattern with little or no waste of the second material, thereby reducing production costs. The method uses first high resolution means, such as focused energy beams of laser, combined with a low resolution means, such as ink-jet, to efficiently provide a high-resolution pattern.