A coinjection molding apparatus includes a manifold, a nozzle body coupled to the manifold, a sleeve disposed within the nozzle body and defining an outer melt channel between the sleeve and the nozzle body, a pin disposed within the sleeve and defining an inner melt channel between the pin and the sleeve, and a nozzle tip having an alignment portion contacting the sleeve. The sleeve is actuated to open and close melt communication of the outer melt channel and a cavity gate. The pin is actuated to open and close melt communication of the inner melt channel and an opening of the sleeve. The alignment portion aligns the sleeve with the cavity gate along the actuated range of the sleeve.

 
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> Method and apparatus for removing a liquid from a surface of a substrate

> Thermally and electrically conductive interface

~ 00515