The invention relates to a radiation-curable liquid resin composition comprising: (A) 20-90 wt % of a urethane(meth)acrylate oligomer, and (B) 1-35 wt % of a monomer shown by the following formula (1), ##STR00001## wherein R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 and R.sup.3 individually represent a hydrogen atom or an alkyl group having 1-4 carbon atoms, R.sup.4 represents a hydrogen atom or a methyl group, and n represents an integer of 1-6, or a monomer including a hydroxyl group.