A fuse (43) is formed overlying a passivation layer (35) and under a packaging material (55, 70). In one embodiment, a fuse (43) is blown before the packaging material (55, 70) is formed. In some embodiments, the fuse (43) may be formed of metal (47), a metal nitride (42) or a combination thereof.

 
Web www.patentalert.com

< Dielectric memory and manufacturing method thereof

> LSI package provided with interface module

> Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment
~ 00520