A multi-chip semiconductor device includes a substrate, a first
semiconductor chip, a second semiconductor chip, and a plastic mold. The
first semiconductor chip has a function for executing a predetermined
electrical operation and is installed on the substrate. The second
semiconductor chip is installed on the first semiconductor chip and is
configured to integrate a power circuit to receive an external power
supply and to supply an electric power to the first semiconductor chip
based on the external power supply. The plastic mold seals together the
first and second semiconductor chips on the substrate.