The present invention provides an inspection apparatus for circuit board for conducting electrical inspection by electrically connecting inspection object electrodes of the circuit board to a plurality of inspection electrodes formed in accordance with a pattern corresponding to the inspection object electrodes through an anisotropically conductive sheet, wherein each of an upper-side board-compressing member and a lower-side board-compressing member respectively arranged on an upper side and lower side of the inspection object circuit board is provided on upper-side base plate and lower-side base plate supported by a plurality of supports of support-infixing plates, and an upper-side supporting point and a lower-side supporting point corresponds to the respective supports on the respective base plates are arranged at positions different from each other on a plane of projection in a thickness-wise direction of the upper-side board-compressing member and lower-side board-compressing member when the inspection apparatus is seen through from above, whereby being capable of conducting the inspection high in reliability even to the circuit board small in such as size of the inspection object electrodes, and an inspection process for circuit board.