A heat dissipation device includes a base (14) for absorbing heat from an electronic device and a plurality of fins (20) arranged on the base. A heat pipe (32) thermally contacts the fins and the base for transferring heat from the base to the fins. The heat pipe includes a U-shaped section thermally mounted below the base for absorbing the heat from the electronic device, two straight sections thermally engaging with the fins, and two arced sections interconnecting the U-shaped section and corresponding straight sections. The heat pipe is integrally formed by bending a straight heat pipe and functions as two U-shaped, individual heat pipes.