The present invention relates to an image pickup device, etc., having a
structure such that electrostatic discharge is unlikely to occur when an
FOP and a CCD reading part are joined. This image pickup device comprises
a semiconductor substrate, provided with the CCD reading part on a front
surface that opposes a back surface, which serves as a light-incident
surface, a package having a cavity in which the semiconductor substrate
is fixed, a cover covering an upper opening of the cavity, an FOP joined
to the semiconductor substrate, and electrical wirings. The cover has a
guiding opening for inserting the FOP into the cavity, and the
semiconductor substrate is thinned at a portion corresponding to a region
at which the CCD reading part is disposed. Also, the semiconductor
substrate is fixed to a bottom surface of the cavity such that the CCD
reading part and the bottom surface face each other, and a light outgoing
end surface of the FOP is optically coupled to the thin part of the
semiconductor substrate in the state of being inserted into the cavity
from the guiding opening.