In the case of employing the wire bonding for the actual element detection in the air bearing surface polishing process and the solder bonding for the connection between the terminals in the assembly process, it has been virtually impossible to satisfy requirements of both of the wire bonding and the solder bonding. According to the embodiment of the invention an MR head and a write head are stacked on an element formation surface of a slider. A lead line connected to electrodes of the MR head is connected to MR element terminals 20 via a copper stud. An outgoing line from coils of the write head is connected to write element terminals via a copper stud. The stacked body of the MR head and the read head, the lead line, and the coil outgoing line are covered with an alumina protection film. The MR element terminals and the write element terminals are formed on the alumina protection film. Each of the MR element terminals and the write element terminals has a slit and is sectioned in a height direction of the slider by the slit.