A semiconductor device comprises IC chips, each having semiconductor elements and pad regions, formed on a substrate, and conductor patterns for detecting displacement of a probe needle during a probing test of the IC chips. The conductor patterns each have an inner conductor and an outer conductor disposed in spaced-apart concentric relationship to one another, and the conductor patterns may be formed on the IC chips or on the substrate in a scribe region between adjacent IC chips. The distance between the inner and outer conductors is smaller than the size of the point or end tip of the probe needle. During a probing test, the probe needle is placed in contact with only the inner conductor, and slight displacement of the probe needle such that it moves into contact with both the inner and outer conductors during the probing test is detected by measuring an electricl characteristic between the two conductors so that corrective action can be taken.