An apparatus may have a multilayered support base having a structural section made up of operating components and a function support section. The function support section may have transmission paths and components to supply thermal, power transmission, information and communication paths, along with other functions. At least some of the components may be heat generating and may have a thermal interface surface which may be in operating and heat conductive relationship with a heat conductive substrate/routing section which may have operative connections to the multilayered support base. Some of the components may transmit and receive with one another through the substrate/routing section.