A heat sink is presented for dissipating heat from an integrated circuit (IC). The heat sink is made of a heat conductive material having a generally planar shape and adapted to receive an IC chip on a bottom surface and adapted to be in thermal connection with the IC chip. The heat sink has a plurality of fins extending from and above a top surface of the heat sink and a plurality of slots providing fluid communication between the top surface and the bottom surface. The plurality of slots allow for air circulation below the heat sink and around the IC and other proximate components to increase heat dissipation.