An electronic apparatus includes a case, a fan, a plurality of electronic parts, and a heat sink mounted for each electronic part. The heat sink includes a fluid unit, and a shutter plate controlling the quantity of air flowing in the heat sink through an action of the fluid unit actuated by heat of the electronic part. The fluid unit includes a container with liquid. The container is heated from the electronic part. When generated heat of the electronic part is large, the fluid inside the container expands, allowing the shutter plate to operate in an opening direction increasing the quantity of air flowing in the heat sink, and in a case when a generated heat quantity of the electronic part is small, the fluid inside the container shrinks, allowing the shutter plate to operate in a closing direction reducing the quantity of air flowing in the heat sink.

 
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> Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)

> Thermal module allowing adjustment in the height of heat sink relative to fixing rack

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