An assembly and adhesive layer for semiconductor components is arranged
between a silicon support (submount) and an electronic functional element
for the formation of an electrically-conducting connection between the
silicon support and the functional element. The assembly and adhesive
layer are arranged on the support. The assembly and adhesive layer are
made from a Ti/TiN layer (6), applied to an aluminum contact surface (5)
of the silicon support (1), by means of a deposition method. The aluminum
contact surface (5) is located on a landing pad (2) on the silicon
support (1).