A processor apparatus is disclosed. The apparatus includes a case with air passages, and a heat dissipation plate structure having a thermally conductive material within the case. It includes a processor having a major surface, where the processor generates heat when energized, and where the heat dissipation plate structure is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor. It also includes a socket assembly, and a circuit board, where the socket assembly is on the circuit board. The pins in the array of pins are configured to be received in the socket assembly.