There is disclosed a plate-shaped pressed body (wafer) produced from an inorganic sorbent and a binder, having a thickness of less than 700 .mu.m, which is produced by the process of compressing a mixture of the inorganic sorbent, the binder, and optionally water and compression aids at a pressure of at least 70 MPa, wherein the weight ratio of dry sorbent to dry binder is between about 4 and 0.7 and the water content of the mixture, measured at 160.degree. C., is between 8 and 20%; and calcining the resulting pressed body at temperatures of at least about 500.degree. C., until the water content is substantially removed.