A head gimbal assembly (HGA) is provided. The HGA includes a suspension that has a suspension coefficient of thermal expansion (CTE) and a slider that has a slider CTE. A bonding element attaches the slider to the suspension. A compensation layer, having a compensation CTE, is located on the suspension. The compensation layer serves to compensate for a thermal distortion of the slider. A method of forming a HGA is also provided. The method includes providing a suspension having a suspension CTE and forming a slider having a slider CTE. The method further includes attaching the slider to the suspension and depositing a compensation layer, having a compensation CTE, on the suspension. The compensation layer serves to compensate for a thermal distortion of the slider.