A method for reducing wafer backside large particle contamination, comprising: performing front end of line processing of a memory device, depositing a thick oxide on the wafer backside so that at least pre-selected oxide thickness remains after back end of line processing is complete and performing the back end of line processing of the memory device.

 
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> Dental intraoral radiological image sensor with a fiber-optic plate

> Compact CMOS-based x-ray detector adapted for dental applications
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