A heat-sensitive apparatus includes a substrate with a top surface, one or
more bars being rotatably joined to the surface and having bimorph
portions, and a plate rotatably joined to the surface and substantially
rigidly joined to the one or more bars. Each bimorph portion bends in
response to being heated. The one or more bars and the plate are
configured to cause the plate to move farther away from the top surface
in response to the one or more bimorph portions being heated.