A hot embossing lithography method includes the steps of: providing a press mold (20) having a press surface, the press surface having a pattern defined therein; providing a substrate (10') having a polymer thin film (30) formed thereon; aligning the press mold with the polymer thin film; introducing a vapor to moisten the press surface for lowering a surface adsorption energy of the press surface; heating the polymer thin film to a temperature above a glass transition temperature of the polymer thin film, thereby softening the polymer thin film; pressing the press mold into the softened polymer thin film to transfer the pattern of the press mold into the polymer thin film; cooling the polymer thin film and the press mold to a temperature near the glass transition temperature of the polymer thin film; and separating the press mold from the polymer thin film.