An objective of the present invention is to form a hyper-elastic flange integrally within a shield case body around a periphery thereof while decreasing an occupied area for grounding. The shield case 2 according to the present invention is disposed to cover electronic parts 6 on a circuit board 1, and which has a flange 7 formed integrally therewith so as to contact with a metallic ground line 3 on the circuit board 1. The flange 7 is elastically deformed to be grounded, thus a leakage of electromagnetic waves to the outside of the shield case 2 is prevented. The flange 7 is made of metallic glass. By forming the flange 7 from metallic glass, a displacement due to viscous flowing on the atomic level, which is different from a plastic deformation, can be utilized, and thus a high precision flange can be formed without a spring-back.