A wafer level package including a semiconductor chip having a plurality of bonding pads on a front surface thereof; a lower insulation layer formed on the semiconductor chip to expose the bonding pads; re-distribution lines formed on the lower insulation layer to be connected to the bonding pads at first ends thereof; an upper insulation layer formed on the lower insulation layer including the re-distribution lines, with portions of the re-distribution lines exposed; solder balls attached to the exposed portions of the re-distribution lines; and a cap covering a rear surface of the semiconductor chip.