A fabric type semiconductor device package is provided. The fabric type
semiconductor device package comprises a fabric type printed circuit
board comprising a fabric and a lead unit formed by patterning a
conductive material on the fabric, a semiconductor device comprising an
electrode unit bonded to the lead unit of the fabric type printed circuit
board, and a molding unit for sealing the fabric type printed circuit
board and the semiconductor device. In the fabric type semiconductor
device package according to the present invention, a fabric type printed
circuit board formed of fabric is used so that a feeling of an alien
substance can be minimized. The fabric type semiconductor device package
can be easily installed. The productivity of the fabric type
semiconductor device package can be improved.