Systems and methods for subterranean distribution of optical signals on integrated circuits are disclosed. A semiconductor device comprising a multi-layer substrate includes a surface layer and a subterranean layer. Electrical devices are formed in the surface layer. Optoelectronic devices may be formed in the subterranean layer or the surface layer and configured for converting electrical signals to optical signals or converting optical signals to electrical signals. At least one optical waveguide is formed in the subterranean layer and configured for transmitting optical signals through the subterranean layer. Electrical vias may be included for coupling electrical signals between the subterranean layer and the surface layer. In addition, optical vias may be for coupling optical signals between the subterranean layer and the surface layer.

 
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< Optical module and method of packaging the same

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