A wired circuit board is provided which can reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a metal foil and an insulating layer to improve the adhesion between the metal foil and the insulating layer and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board by sputtering or electrolytic plating. A metal foil is formed on the first metal thin film by electrolytic plating. A second metal thin film is formed over the metal foil and the metal supporting board by electroless plating or sputtering. An insulating base layer is formed on the second metal thin film. A conductive pattern is formed as a wired circuit pattern on the insulating base layer. An insulating cover layer is formed on the insulating base layer to cover the conductive pattern.