An integrated circuit device includes a substrate including a trench
therein and a conductive plug wire pattern in the trench. The conductive
plug wire pattern includes a recessed portion that exposes portions of
opposing sidewalls of the trench, and an integral plug portion that
protrudes from a surface of the recessed portion to provide an electrical
connection to at least one other conductive wire pattern on a different
level of metallization. A surface of the plug portion may protrude to a
substantially same level as a surface of the substrate adjacent to and
outside the trench, and the surface of the recessed portion may be below
the surface of the substrate outside the trench. Related fabrication
methods are also discussed.