A multi-chip package including a carrier, a first chip, a second chip and
a first conductive layer is provided. The first chip is disposed on the
carrier and is electrically connected to the carrier through at least one
first wire. The second chip is disposed on the first chip and is
electrically connected to the first chip through at least one second
wire. The first conductive layer is disposed on the second chip and is
electrically connected to the first chip or the second chip through at
least one third wire. The first conductive layer is electrically
connected to the carrier through the at least one fourth wire.