A semiconductor device comprising a plurality of first wirings provided in a predetermined layer on a substrate with being lined up, and formed to extend longer or contract shorter from one side toward the other side along a direction in which the first wirings are lined up, adjacent one-end portions of the first wirings being arranged in positions displaced from one another in a direction crossing at right angles the direction in which the first wirings are lined up.

 
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< Thermal enhanced package

> Interconnect structure using through wafer vias and method of fabrication

> Removable wafer expander for die bonding equipment

~ 00586