An electronic device includes a first silicon-based circuit carrying
substrate and a die carried by the first silicon-based circuit carrying
substrate. The silicon-based circuit carrying substrate is configured to
electrically connect the die to other die. The device may include a
second silicon-based circuit carrying substrate. The second silicon
circuit carrying substrate may be closely coupled to the first
silicon-based circuit carrying substrate. The device may also include a
second die carried by the second silicon-based circuit carrying
substrate.