A heat sink and an electronic apparatus using the same are disclosed. The
heat sink comprises a fin structure and a fastening assembly; the
fastening assembly comprises an adjustable positioning member, an elastic
member, and a hooking member, the elastic member being disposed between
the hooking member and the fin structure such that the adjustable
positioning member combines the hooking member, the elastic member, and
the fin structure; wherein the hooking member may secure the heat sink
onto an electronic component, and the adjustable positioning member may
be used to adjust the tightness between the heat sink and the electronic
component.