A non-volatile memory device (e.g., a split gate type device) and a method of manufacturing the same are disclosed. The memory device includes an active region on a semiconductor substrate, a pair of floating gates above the active region, a charge storage insulation layer between each floating gate and the active region, a pair of wordlines over the active region and partially overlapping the floating gates, respectively, and a gate insulation film between each wordline and the active region. The method may prevent or reduce the incidence of conductive stringers on the active region between the floating gates, to thereby improve reliability of the memory devices and avoid the active region resistance from being increased due to the stringer.

 
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< Back-gated semiconductor device with a storage layer and methods for forming thereof

> Semiconductor device and method of manufacturing the same

> Semiconductor device and method of fabricating the same

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