A test structure for electromigration and related method are disclosed. The test structure may include an array of a plurality of multilink test sets, each multilink test set including a plurality of metal lines positioned within a dielectric material and connected in a serial configuration; each multilink test set being connected in a parallel configuration with the other multilink test sets, the parallel configuration including a first electrical connection to a cathode end of a first metal line in each multilink test set and a second electrical connection to an anode end of a last metal line in each multilink test set.