The present invention provides a semiconductor device, a fabrication
method therefor, and a film fabrication method, the semiconductor device
including a first substrate (e.g., a semiconductor chip), an anisotropic
conductive film that is provided on the first substrate and has a wiring
pattern having at least a portion providing conduction through the
anisotropic conductive film, and a second substrate (semiconductor chip)
provided on the anisotropic conductive film and coupled to the first
substrate via the portion providing conduction through the anisotropic
conductive film. According to the present invention, it is possible to
provide a semiconductor device, a fabrication method therefor, and a film
fabrication method, by which production costs can be reduced in
electrically coupling different positions in upper and lower substrates.