Provided is a laser machining apparatus. The laser machining apparatus
includes: a laser oscillator emitting laser beams; a first dividing means
on which the laser beams emitted from the laser oscillator are incident
to be selectively divided so that the incident laser beams progress along
at least one path from among a pair of first paths; a second dividing
means on which the laser beams that passed through any one of the first
paths are incident to be selectively divided so that the incident laser
beams progress along at least one path from among a pair of second paths;
a third dividing means on which the laser beams that passed through the
other one of the first paths are incident to be selectively divided so
that the incident laser beams progress along at least one path from among
a pair of third paths; four pairs of scanners on which the laser beams
that passed through the first, second, and third dividing means are
incident to each be deflected onto desired positions on a substrate so as
to be processed; and a scan lens on which the laser beams that passed
through the four pairs of scanners are incident to be collected on a spot
having a predetermined diameter and irradiated onto the substrate.