A system that facilitates high-speed data transfer between integrated circuit chips. The system contains a first integrated circuit chip, which includes a capacitive receiver and an electrical-to-optical transceiver. The capacitive receiver receives a capacitively coupled voltage signal transmitted from a corresponding capacitive transmitter located on a second integrated circuit chip and converts the capacitively coupled voltage signal into an electrical signal. The electrical-to-optical transceiver converts the electrical signal to an optical signal and transmits the optical signal to an optical device through optical coupling.

 
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< Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication

> Production device and production method for an optical device component having a grating structure

> Semiconductor-based broadband modulators

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