A process for producing a pre-plated leadframe that has enhanced adhesion
by molding compound is provided, wherein a base leadframe material is
first plated with multiple layers of metallic material. Thereafter, the
plated base leadframe material is covered with a mask, so as to expose
selected surfaces thereof at unmasked areas where enhanced adhesion of
molding compound is desired. The said unmasked areas are plated with a
layer of copper before removing the mask. Optionally, the layer of copper
may further be oxidized to form a layer of specially controlled copper
oxide.