The present invention provides a semiconductor device which is applied to,
for example, a WCSP (Wafer Level Chip Size Package) and comprises a
semiconductor chip having a high-frequency circuit block, a plurality of
electrode pads formed on the semiconductor chip, posts disposed between
the high-frequency circuit block and the electrode pads within a
horizontal plane and connected to their corresponding external terminals,
and redistribution wiring layers that connect the electrode pads and the
posts respectively.
