A mounting process/device for mounting and alignment of micro optical electro-mechanical systems (MOEMS) elements and/or devices. The mounting process/device can be obtained by attaching at least one optical element onto a mounting system, which contains an embedded optical element. The attached optical element(s) are aligned with respect to the embedded optical element.

 
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> Integrated-circuit chip with offset external pads and method for fabricating such a chip

> Method of manufacturing a wiring substrate and semiconductor device

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