A semiconductor device (1700), which comprises a workpiece (1201) with an
outline (1711) and a plurality of contact pads (1205) and further an
external part (1701) with a plurality of terminal pads (1702). This part
is spaced from the workpiece, and the terminal pads are aligned with the
workpiece contact pads, respectively. A reflow element (1203)
interconnects each of the contact pads with its respective terminal pad.
Thermoplastic material (1204) fills the space between the workpiece and
the part; this material adheres to the workpiece, the part and the reflow
elements. Further, the material has an outline (1711) substantially in
line with the outline of the workpiece, and fills the space (1707)
substantially without voids. Due to the thermoplastic character of the
filling material, the finished device can be reworked, when the
temperature range for reflowing the reflow elements is reached.